Current sensor assemblies for low currents

ABSTRACT

A current sensor assembly can include: a coil structure having a first coil and a second coil connected in series, the coil structure configured to generate a differential magnetic field responsive to an electrical current passing through the first and second coils; a first magnetic field sensing element disposed proximate to the first coil and operable to generate a first signal responsive to the differential magnetic field passing through the first magnetic field sensing element in a first direction; a second magnetic field sensing element disposed proximate to the second coil and operable to generate a second signal responsive to the differential magnetic field passing through the second magnetic field sensing element in a second direction; and a circuit operable to subtract the first and second signals to generate a differential signal proportional to the electrical current.

BACKGROUND

Various types of electrical current sensors are known in the art. Magnetic field current sensors include one or more magnetic field sensing elements positioned near a conductor to sense a magnetic field generated by an electrical current flowing through the conductor. In some arrangements, a magnetic field current sensor can generate an output signal having a magnitude proportional to the magnetic field induced by the current through the conductor. In other arrangements, a magnetic field sensor can generate an output signal having a magnitude proportional to the difference in magnetic fields induced by two currents following through two different conductors.

Current sensors are used in many applications including automotive, industrial, and other safety-critical applications. The overall safety of systems and devices that utilize current sensors can depend on the accuracy and reliability of the current sensors.

SUMMARY

In many current sensing applications, such as measuring battery leakage, the current to be measured may be in the range of hundreds of milliampere to below five amperes. With conventional current sensor assemblies, it can be challenging to measure such a “low” current accurately due to the relatively weak magnetic field induced by the current flowing through a conductor, resistance/inductance constraints, and/or cost constraints.

Described herein are embodiments of current sensors and current sensor assemblies that can be used to accurately measure low currents while being cost-effective. Disclosed embodiments include conductive coil or loop structures that can be formed upon printed circuit boards (PCBs) that are assembled with differential magnetic field sensors, or that can be formed as part of the differential magnetic field sensors themselves. In addition to low current sensing applications, certain embodiments may be suitable for use in differential current sensing applications, such as detecting current leak.

According to an aspect of the disclosure, a current sensor assembly may include: a coil structure having a first coil and a second coil connected in series, the coil structure configured to generate a differential magnetic field responsive to an electrical current passing through the first and second coils; a first magnetic field sensing element disposed proximate to the first coil and operable to generate a first signal responsive to the differential magnetic field passing through the first magnetic field sensing element in a first direction; a second magnetic field sensing element disposed proximate to the second coil and operable to generate a second signal responsive to the differential magnetic field passing through the second magnetic field sensing element in a second direction; and a circuit operable to subtract the first and second signals to generate a differential signal proportional to the electrical current.

In some embodiments, the coil structure can be formed upon a printed circuit board (PCB) and the first and second magnetic field sensing elements can be disposed over the PCB.

In some embodiments, the first coil and the second coil can be formed upon a first layer of the PCB and the first coil and the second coil may be connected by a conductive path formed upon a second layer of the PCB. In some embodiments, the PCB may include a first via to connect the first coil to the conductive path and a second via to connect the second coil to the conductive path. In some embodiments, the coil structure can further have a third coil and a fourth coil configured to contribute to the differential magnetic field responsive to the electrical current passing through the third and fourth coils.

In some embodiments, the third and fourth coils may be formed upon the second layer of the PCB and connected to the first and second coils, respectively, by vias of the PCB. In some embodiments, the coil structure can include a plurality of coils including at least the first and second coils, and at least two coils from the plurality of coils may be formed on different layers of the PCB and interconnected by vias. In some embodiments, the first magnetic field sensing element, the second magnetic field sensing element, and the circuit may be provided within an integrated circuit (IC) package disposed over the PCB.

In some embodiments, the first and second magnetic field sensing elements can include planar Hall elements. In some embodiments, the first and second magnetic field sensing elements can include vertical Hall elements. In some embodiments, the current sensor may further include: a third magnetic field sensing element disposed proximate to the first coil and operable to generate a third signal responsive to the differential magnetic field passing through the third magnetic field sensing element; and a fourth magnetic field sensing element disposed proximate to the second coil and operable to generate a fourth signal responsive to the differential magnetic field passing through the fourth magnetic field sensing element, and the circuit can be further operable generate the differential signal using the third and fourth signals. In some embodiments, the third and fourth magnetic field sensing elements can include vertical Hall elements.

In some embodiments, the current sensor assembly may further include one or more magnetic flux concentrators operable to influence the differential magnetic field to pass through the first magnetic field sensing element in the first direction and to influence the differential magnetic field to pass through the second magnetic field sensing element in the second direction. In some embodiments, the one or more magnetic flux concentrators may include a first magnetic flux concentrators disposed proximate to the first magnetic field sensing element and a second magnetic flux concentrators disposed proximate to the second magnetic field sensing element. In some embodiments, the one or more magnetic flux concentrators may include a single magnetic flux concentrator disposed proximate to both the first and second magnetic field sensing elements.

In some embodiments, the circuit may be provided with a die, and the first magnetic field sensing element, the second magnetic field sensing element, and the die may be overmolded onto a PCB onto which the coil structure is formed. In some embodiments, the circuit may be provided with a die, and the first magnetic field sensing element, the second magnetic field sensing element, the die, and the coil structure may be formed within an integrated circuit (IC) package.

According to another aspect of the disclosure, a current sensor assembly can include: a first coil structure configured to generate a first magnetic field responsive to a first electrical current passing through the first coil structure; a second coil structure configured to generate a second magnetic field responsive to a first electrical current passing through the second coil structure; a first magnetic field sensing element disposed proximate to the first coil structure and operable to generate a first signal responsive to the first magnetic field passing through the first magnetic field sensing element in a direction; a second magnetic field sensing element disposed proximate to the second coil structure and operable to generate a second signal responsive to the second magnetic field passing through the second magnetic field sensing element in the same direction; and a circuit operable to subtract the first and second signals to generate a differential signal proportional to a difference between the first and second electrical currents.

According to another aspect of the disclosure, a current sensor assembly may include: a plurality of magnetic field sensing elements disposed on a substrate; a conductive path formed onto the substrate and arranged to loop around ones of the plurality of magnetic field sensing elements to generate a magnetic field about the magnetic field sensing elements responsive to an electrical current passing through the conductive path, wherein at least magnetic field passes through at least one of the magnetic field sensing elements in a first direction and at least another one of the magnetic field sensing elements in a second direction; and one or more differential circuits operable to subtract signals generated by the plurality of magnetic field sensing elements and to generate one or more differential signals proportional to the electrical current.

In some embodiments, a first pair of the plurality of magnetic field sensing elements can be connected to a first one of the one or more differential circuits and a second pair of the plurality of magnetic field sensing elements can be connected to a second one of the one or more differential circuits. In some embodiments, a first two or more of the plurality of magnetic field sensing elements can be connected together, a second two or more of the plurality of magnetic field sensing elements can be connected together, and the first two or more and the second two or more of the plurality of magnetic field sensing elements can be connected to a same one of the one or more differential circuits.

It should be appreciated that individual elements of different embodiments described herein may be combined to form other embodiments not specifically set forth above. Various elements, which are described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination. It should also be appreciated that other embodiments not specifically described herein are also within the scope of the following claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The manner of making and using the disclosed subject matter may be appreciated by reference to the detailed description in connection with the drawings, in which like reference numerals identify like elements.

FIG. 1 is a diagram showing a top view of a current sensor assembly including a dual coil structure and two magnetic field sensing elements disposed proximate thereto, according to embodiments of the present disclosure.

FIG. 1A is a diagram showing a perspective view of the dual coil structure included within the current sensor assembly of FIG. 1 .

FIG. 1B is a diagram showing a side view of the current sensor assembly of FIG. 1 .

FIG. 2 is a block diagram of a current sensor that can be used within a current sensor assembly, according to embodiments of the present disclosure.

FIG. 3 is a diagram showing a perspective view of a quad coil structure that can be included within a current sensor assembly, according to embodiments of the present disclosure.

FIG. 4 is a plot showing magnetic fields that can be induced by a dual coil structure and a quad coil structure, according to embodiments of the present disclosure.

FIG. 5 is a diagram showing a top view of a current sensor assembly including a coil structure with two electrically separate coils and further including two magnetic field sensing elements disposed proximate thereto, according to embodiments of the present disclosure.

FIG. 6 is a diagram showing a side view of a current sensor assembly including a dual coil structure, two magnetic field sensing elements disposed proximate thereto, and a single magnetic flux concentrator, according to embodiments of the present disclosure.

FIG. 7 is a diagram showing a side view of a current sensor assembly including a dual coil structure, two magnetic field sensing elements disposed proximate thereto, and two magnetic flux concentrators, according to embodiments of the present disclosure.

FIG. 8 is a diagram showing a top view of a current sensor assembly including a dual coil structure and four magnetic field sensing elements disposed proximate thereto, according to embodiments of the present disclosure.

FIG. 9 is a diagram showing a side view of a current sensor assembly having a die and a coil structure formed as a single module, according to embodiments of the present disclosure.

FIG. 10 is a diagram showing a side view of a current sensor assembly including a conductive coil or loop structure integrated into a current sensor package, according to embodiments of the present disclosure.

FIG. 11 is a diagram showing a top view of a current sensor assembly including a conductive loop structure integrated into a current sensor package, according to embodiments of the present disclosure.

The drawings are not necessarily to scale, or inclusive of all elements of a system, emphasis instead generally being placed upon illustrating the concepts, structures, and techniques sought to be protected herein.

DETAILED DESCRIPTION

Referring to FIG. 1 , a current sensor assembly 100 can include a dual coil structure 102 and two magnetic field sensing elements 104 a, 104 b disposed proximate thereto, according to embodiments of the present disclosure. The illustrative coil structure 102 can include a first coil 106 a and a second coil 106 b connected in series by a conductive path (or “return path”) 108. The coils 106 a, 106 b and return path 108 may be formed from any electrically conductive material, such as copper or another metal. As shown, first coil 106 a may wind/loop one or more times in a counter-clockwise direction starting from an outer terminal 110 and ending at an inner terminal 112. Second coil 106 b may wind/loop one or more times in a clockwise direction starting from an inner terminal 114 and ending at an outer terminal 116. The inner terminals 112, 114 may be connected to opposite ends of the return path 108, as shown.

The number of windings in the first and second coils 106 a, 106 b, along with the dimensions and shapes of the windings, may be selected according to the requirements of a particular application in which the current sensor assembly 100 is to be used. In general, increasing the number of coil windings will result in increased magnetic coupling factor (or “gain”), while also resulting in increased impedance through the conductive path. The term “magnetic coupling factor” refers to the strength of a magnetic field generated by a current flowing through a conductive coil or loop structure divided by the magnitude of the current. In some examples, magnetic coupling factor may be expressed in units of Gauss (G)/Ampere (A). Thus, for example, if an application involves the sensing of particularly low currents (e.g., in the range of hundreds of milliampere), then the number of coil windings may be increased to increase the magnetic coupling factor. As another example, if an application requires low impedance, then the number of coils may be decreased. The structures and techniques sought to be protected herein are not limited to the coil shapes and dimensions illustrated in FIG. 1 . For example, in some embodiments, first and second coils 106 a, 106 b may be circular, rectangular, triangular, or of another shape. Likewise, the length, width, and trace thickness of the coils 106 a, 106 b may vary.

The outer terminals 110, 116 may constitute a port that can be connected to external circuitry (e.g., a current source) that carries an electrical current to be measured. For example, coil structure 102 may be connected to an external circuitry such that a current “I” flows into the outer terminal 110 of the first coil, counter-clockwise through the first coil 106 a, through the return path 108, clockwise through the second coil 106 b, and out of the outer terminal 116 of the second coil 106 b. In this way, the coil structure 102 generates a differential magnetic field responsive to an electrical current flowing between the outer terminals 110, 116. That is, current flowing through the first coil 106 a generates (or “induces”) a first magnetic field, B+, having a first direction, whereas the current flowing through the second coil 106 b generates a second magnetic field, B−, having a second, opposite direction. In the example of FIG. 1 , first magnetic field, B+, is directed out from the page and second magnetic field, B−, is directed into the page. In this arrangement, outer terminal 110 may be referred to as an input terminal/connection and outer terminal 116 may be referred to as an output terminal/connection. In some embodiments, the direction of current flow—and thus the directions of the magnetic fields—may be reversed.

The magnetic field sensing elements 104 a, 104 b may be configured to generate signals responsive to the differential magnetic field. In more detail, first magnetic field sensing element 104 a may be configured to generate a first signal responsive to the first magnetic field, B+, passing therethrough in a first direction and second magnetic field sensing element 104 b may be configured to generate a second signal responsive to the second magnetic field, B−, passing therethrough in the second, opposite direction.

As used herein, the term “magnetic field sensing element” is used to describe a variety of electronic elements that can sense a magnetic field. A magnetic field sensing element can be, but is not limited to, a Hall effect element, a magnetoresistance element, or a magneto-transistor. As is known, there are different types of Hall effect elements, for example, a planar Hall element, a vertical Hall element, and a Circular Vertical Hall (CVH) element. As is also known, there are different types of magnetoresistance elements, for example, a semiconductor magnetoresistance element such as Indium Antimonide (InSb), a giant magnetoresistance (GMR) element, for example, a spin valve, an anisotropic magnetoresistance element (AMR), a tunneling magnetoresistance (TMR) element, and a magnetic tunnel junction (MTJ). A magnetic field sensing element may be a single element or, alternatively, may include two or more magnetic field sensing elements arranged in various configurations, e.g., a half bridge or full (Wheatstone) bridge. Depending on the device type and other application requirements, the magnetic field sensing element may be a device made of a type IV semiconductor material such as Silicon (Si) or Germanium (Ge), or a type III-V semiconductor material like Gallium-Arsenide (GaAs) or an Indium compound, e.g., Indium-Antimonide (InSb).

As is known, some of the above-described magnetic field sensing elements tend to have an axis of maximum sensitivity parallel to a substrate that supports the magnetic field sensing element, and others of the above-described magnetic field sensing elements tend to have an axis of maximum sensitivity perpendicular to a substrate that supports the magnetic field sensing element. In particular, planar Hall elements tend to have axes of sensitivity perpendicular to a substrate, while metal based or metallic magnetoresistance elements (e.g., GMR, TMR, AMR) and vertical Hall elements tend to have axes of sensitivity parallel to a substrate.

Certain embodiments disclosed herein may be shown as having planar Hall elements. However, other types of magnetic field sensing elements may be used in some cases. For example, planar Hall elements may be replaced with and/or used in combination with vertical Hall elements or magnetoresistance elements, which can be disposed upon substrates in a manner such that they are responsive to the relevant magnetic fields.

Referring again to FIG. 1 , magnetic field sensing elements 104 a, 104 b may have axes of sensitivity perpendicular to the page of FIG. 1 . In some embodiments, magnetic field sensing elements 104 a, 104 b may be provided as Hall elements, such as planar Hall elements.

Magnetic field sensing elements 104 a, 104 b may be provided as part of a current sensor that includes an electronic circuit (not shown), all disposed upon a common substrate (also not shown), such as a substrate comprising a semiconductor material. The circuit may be operable to receive the first signal generated by the first magnetic field sensing element 104 a and the second signal generated by the second magnetic field sensing element 104 b, and to generate a differential signal proportional to the electrical current flowing through the coil structure 102 (e.g., by subtracting the first and second signals). The current sensor circuit may be configured to perform other signal processing, such as current spinning, filtering, an amplification. FIG. 2 shows an example of a current sensor within which magnetic field sensing elements 104 a, 104 b may be provided. That is, the illustrative current sensor of FIG. 2 may be included within the assembly 100.

As used herein, the term “current sensor” can refer to one or more magnetic field sensing elements and electronic circuitry configured to process signals generated thereby. The term “current sensor assembly” can refer to a current sensor combined with a conductive coil or loop structure for carrying a current to be sensed by the current sensor.

In some embodiments, coil structure 102 may be formed upon or within a printed circuit board (PCB), and magnetic field sensing elements 104 a, 104 b and the sensor circuitry may be formed on a die and packaged within an integrated circuit (IC) package or chip (referred to herein as the “current sensor package”). The current sensor package may be disposed over the PCB to form the current sensor assembly 100. For example, the current sensor package may be surface mounted over the PCB using adhesive or mechanical fasteners. This and other means of packaging disclosed current sensor assemblies are discussed further below.

FIG. 1A shows a perspective view of the coil structure 102 of FIG. 1 . The coil structure 102 may be formed on a PCB having two or more conductive layers (e.g., copper sheets) separated by one or more insulating layers (e.g., layers of non-conductive substrate). Two different conductive layers by interconnected by vias (i.e., plated-through holes) formed through one or more of the insulating layers. In more detail, first and second coils 106 a, 106 b may be formed on a first conductive layer of a PCB and return path 108 may be formed on a second conductive layer of the PCB. Thus, first and second coils 106 a, 106 b may be referred to as “planar coils” and coil structure 102 may be referred to as a “planar differential coil.” Return path 108 can be connected to the first and second coils 106 a and 106 b by vias 120 a and 120 b, respectively. In some cases, coils 106 a, 106 b and return path 108 may be printed onto the conductive layers using a subtractive process. For example, coils 106 a, 106 b and return path 108 may be etched from copper sheets corresponding to the first and second conductive layers. In other cases, an additive printing process may be used. Copper is just one example of a conductive material that can be used to form coil structure 102 and various other conductive materials may be used. To promote clarity in the drawings, only the conductive elements 106 a, 106 b, 108, 120 a, and 120 b are shown in FIG. 1 and the remaining portions of the PCB are omitted.

The magnetic field sensing elements 104 a and 104 b of FIG. 1 may be disposed over the coil structure 102 at positions 122 a and 122 b, respectively. For example, positions 122 a, 122 b may correspond to center positions of Hall elements.

In the example of FIG. 1A, the magnetic field sensing element positions 122 a, 122 b have a position along the Z axis at approximate 0.9 mm, the first conductive layer onto which coils 106 a, 106 b is formed has a position along the Z axis of 0 mm, and the second conductive layer onto which return path 108 is formed has a position along the Z axis of −0.2 mm. The dimensions illustrated in FIG. 1A are merely illustrative and other dimensions may be used.

FIG. 1B shows a side view of the current sensor assembly 100 of FIG. 1 . As shown, a PCB 140 can include a substrate 142, a first conductive layer 144, and a second conductive layer 146. First and second coils 106 a, 106 b of the coil structure can be formed on the first conductive layer 144 and return path 108 may be formed on the second conductive layer 146. The PCB 140 can further include vias 120 a, 120 b that electrically connect coils 160 a, 160 b to return path 108.

The conductive layers 144, 146 can have a thickness D1 and may be spaced apart (e.g., vertically spaced) by a distance D2. The first conductive layer 144 may be spaced apart from a surface (e.g., a top surface) 148 of the PCB 140 by a distance D3. Magnetic field sensing elements 104 a, 104 b may be spaced apart from the surface 148 of the PCB 140 by a distance D4. As one example, D1 may be about 75 μm, D2 may be about 200 μm, D3 may be about 150 μm, and D4 may be about 750 μm. These dimensions are merely illustrative and other dimensions may be used.

The illustrative current sensor assembly 100, having a printed planar, winded coil structure on a PCB with the multiple surface mounted magnetic field sensing elements, can provide a higher magnetic coupling factor and signal-to-noise-ratio (SNR) compared to existing current sensor assemblies/designs. The low current to be measured flows through the coils to generates a relatively strong differential magnetic field that is applied to the magnetic field sensing elements. As such, current sensor assembly 100 provides a contactless, non-intrusive current sensing solution allowing for more accurate sensing of low currents (current flowing through the coil structure) while also being versatile and cost-effective by using simple coils structure directly printed on PCB. The structures and techniques disclosed herein can be used with various types of differential field sensors and magnetic sensor technologies (e.g., Hall, GMR, TMR, etc.).

FIG. 2 shows an example of a current sensor 200 that can be used within various current sensor assembly embodiments disclosed herein. For example, current sensor 200 can be provided within the current sensor assembly 100 of FIG. 1 . The illustrative current sensor 200 can include first and second magnetic field sensing elements 204, 214 coupled to an electronic circuit 201. The magnetic field sensing elements 204, 214 can be coupled between a voltage source 202 and a ground or reference voltage. The first magnetic field sensing element 204 can generate a first differential signal 204 a, 204 b and the second magnetic field sensing element can generate a second differential signal 214 a, 214 b.

In some embodiments, the first differential signal 204 a, 204 b and the second differential signal 214 a, 214 b can be opposite signals, e.g., signals with opposite voltages. For example, if current sensor 200 is used within the assembly 100 of FIG. 1 , the coil structure coil structure 102 may generate two magnetic fields having opposite directions, with first magnetic field sensing element 204 sensing one field and second magnetic field sensing element 214 sensing the other, oppositely-directed field. In other embodiments, first differential signal 204 a, 204 b and the second differential signal 214 a, 214 b may be independent signals, meaning the signals may be responsive to fields generated by two different currents. For example, current sensor 200 may be used to calculate a difference between two different currents within an assembly such as that described below in the context of FIG. 5 . In this configuration, the current sensor may be referred to as a “differential current sensor.”

In some embodiments, magnetic field sensing elements 204, 214 may be planar Hall elements. A planar Hall element can be a four terminal device having a square shape, from a top view. A voltage and ground can be applied to a pair of diagonally opposing terminals, respectively, and a differential voltage can be generated across the other pair of diagonally opposing terminals. In some applications, in order to reduce a DC offset voltage (voltage indicative of a magnetic field when no magnetic field is present), the pair of terminals selected for coupling to the voltage and ground, and the pair of terminals selected for the differential signal from the Hall element changes from time to time, generally at a high rate of change. There are four such coupling assemblies for a planar Hall element. When operating, the coupling assemblies can be referred to as current spinning.

Accordingly, the illustrative electronic circuit 201 can include a first current spinning circuit 206 coupled to receive the first differential signal 204 a, 204 b, which can come from first selected pairs of terminals of the first magnetic field sensing element 204. Not shown, the first current spinning circuit 206 can also control to which second pairs of terminals of the first magnetic field sensing element 204 the voltage 202 and ground are coupled in synchronous relationship with the first pairs of terminals. The first current spinning circuit 206 can generate a first spinning signal 206 a. With the current spinning assembly, the first spinning signal can have two or more spectral parts, for which a desired baseband part can be indicative of a magnetic field sensed by the first magnetic field sensing 204 and a second higher frequency part can be indicative of the DC offset voltage. The spinning signal 206 a can be coupled to a low pass filter 208 operable to generate a first filtered signal 208 a that can include only the desired baseband part.

Elements 216 and 218 can operate in the same way as elements 206, 208, and can result in a second filtered signal 218 a. In some embodiments, current spinning is not used and the current spinning circuits 206, 216 can be omitted. In some embodiments, low pass filters 208, 218, can be omitted.

A differencing circuit 210 can be coupled to the first and second filtered signals 208 a, 218 a, respectively, and can be operable to generate a difference signal 210 a. An amplifier 212 can be coupled to the difference signal 210 a and can be operable to generate an amplified difference signal 212 a.

In embodiments where magnetic fields pass through the first and second magnetic field sensing elements, 208, 210 in opposite direction, and therefore generate opposite signals, differencing circuit 210 operates to combine the first and second filtered signals 208 a, 218 a constructively. In embodiments where different/independent magnetic fields magnetic fields pass through the first and second magnetic field sensing elements, 208, 210 (i.e., fields generated from two different or independent currents), differencing circuit 210 operates to calculate the difference between the first and second filtered signals 208 a, 218 a. That is, differencing circuit 210 can output a signal that is responsive to the difference between the two independent currents.

Turning to FIG. 3 , embodiments of the present disclosure can utilize a quad coil structure to increase the magnetic coupling factor, resulting in higher magnetic field sensed and higher SNR. An illustrative coil structure 302 includes first and second coils 306 a, 306 b formed on a first layer (e.g., a first conductive layer of a PCB) and third and fourth coils 330 a, 330 b formed on a second layer (e.g., a second conductive layer of the PCB). The first and third coils 306 a, 330 a may be electrically connected by a first via 320 a and the second and fourth coils 306 a, 330 b may be electrically connected by a second via 320 b. The third and fourth coils 330 a, 330 b may be electrically connected by a return path 308, as shown. With this design, the second layer is not only used to inter-connect the left and right coils (i.e., first a second coils 406 a, 306 b) but also to provide another set of coils (i.e., third and fourth coils 330 a, 330 b) to increase the magnetic coupling factor.

The number of windings in the coils 306 a, 306 b, 330 a, 330 b, along with the dimensions and shapes of the windings, may be varied according to the requirements of a particular application. The illustrative coil structure 302 may be provided within various current sensor assemblies disclosed herein. For example, referring to the current sensor assembly 100 of FIG. 1 , dual coil structure 102 may be replaced with quad coil structure 302 of FIG. 3 .

FIG. 4 is a plot showing magnetic fields that can be induced by a dual coil structure and a quad coil structure, according to embodiments of the present disclosure. Illustrative plot 400 includes a horizontal axis 402 x representing current flowing through a particular coil structure (i.e., a current to be sensed) and a vertical axis 402 y corresponding to the strength of the magnetic field generated for the current. A first curve 404 illustrates a magnetic coupling factor (G/A) for a dual coil structure (e.g., dual coil structure 102 of FIG. 1A) and a second curve 406 illustrates a magnetic coupling factor for a quad coil structure (e.g., quad coil structure 302 of FIG. 3 ). As shown by curve 404, a dual coil structure may achieve a magnetic coupling factor or about 18G/A and, as shown by curve 406, a quad coil structure may achieve a differential magnetic coupling factor or about 28G/A as seen by the sensor circuitry. Thus, in some cases, a quad coil structure formed on multiple layers of a PCB may increase the coupling factor and SNR, and thus allow for lower current to be sensed.

FIG. 5 shows another example of a current sensor assembly according to embodiments of the present disclosure. Current sensor assembly 500 can be used for differential current sensing, that is to calculate a difference between a first electrical current, I₁, and a second electrical current, I₂. Illustrative current sensor assembly 500 includes a coil structure 502 and two magnetic field sensing elements 504 a, 504 b disposed proximate thereto.

The illustrative coil structure 502 can include a first coil 506 a electrically connected to a first return path 508 a, and a second coil 506 b electrically connected to a second return path 508 b. The first and second coils 506 a, 506 a may be electrically separated or isolated from each other. The coils 506 a, 506 b and return paths 508 a, 508 b may be formed from any electrically conductive material, such as copper or another metal. As shown, first coil 506 a may wind/loop one or more times in a counter-clockwise direction starting from a first input terminal 510 a and ending at a first inner terminal 512 a. One end of the first return path 508 a may be connected to the first inner terminal 512 a and the opposite end of the first return path 508 a may correspond to a first output terminal 514 a. Second coil 506 b may wind/loop one or more times, also in a counter-clockwise direction, starting from a second input terminal 510 b and ending at a second inner terminal 512 b. One end of the second return path 508 b may be connected to the second inner terminal 512 b and the opposite end of the second return path 508 b may correspond to a second output terminal 514 b.

The number of windings in the first and second coils 506 a, 506 b, along with the dimensions and shapes of the windings, may be selected according to the requirements of a particular application in which the current sensor assembly 500 is to be used.

The first input terminal 510 a and first output terminal 514 a may constitute a first port that can be connected to external circuitry (e.g., a first current source) that carries the first current, I₁. The first current, I₁, can flow into the first input terminal 510 a, counter-clockwise through the first coil 506 a, through the first return path 508 a, and out of the first output terminal 514 a. Likewise, second input terminal 510 b and second output terminal 514 b may constitute a second port that can be connected to external circuitry (e.g., a second current source) that carries the second current, I₂. The second current, I₂, can flow into the second input terminal 510 b, counter-clockwise through the second coil 506 b, through the second return path 508 b, and out of the second output terminal 514 b. The currents flowing through the first and second coils 506 a, 506 b can generate respective first and second magnetic fields B_(L), B_(R) both having the same direction (e.g., out from the page of FIG. 5 ). In some embodiments, the direction of current flow—and thus the directions of the magnetic fields—may be reversed.

Magnetic field sensing elements 504 a, 504 b may be configured to generate signals responsive to magnetic fields B_(L), B_(R) respectively. Magnetic field sensing elements 504 a, 504 b may have axes of sensitivity perpendicular to the page of FIG. 5 . In some embodiments, magnetic field sensing elements 504 a, 504 b may be provided as Hall elements, such as planar Hall elements.

Magnetic field sensing elements 504 a, 504 b may be provided as part of a current sensor that includes an electronic circuit (not shown), all disposed upon a common substrate (also not shown). The circuit may be operable to receive the first signal generated by the first magnetic field sensing element 504 a and the second signal generated by the second magnetic field sensing element 504 b, and to generate an output signal proportional to a difference between the first current, I₁, and the second current, I₂. That is, current sensor assembly 500 can perform differential current sensing, where the differential field sensed B_(L)−B_(R) is proportional to the difference I₁−I₂. The current sensor circuit may be configured to perform other signal processing, such as current spinning, filtering, an amplification. FIG. 2 shows an example of a current sensor within which magnetic field sensing elements 504 a, 504 b may be provided. That is, the illustrative current sensor of FIG. 2 may be included within the assembly 500.

In some embodiments, coil structure 502 may be formed upon or within a PCB. In more detail, first and second coils 506 a, 506 b may be formed on a first conductive layer of the PCB and first and second return paths 508 a, 508 b may be formed on a second conductive layer of the PCB. First return path 508 a may be connected to the inner terminal 512 a of the first coil 506 a by a first via and second return path 508 b may be connected to the inner terminal 512 b of the second coil 506 b by a second via. The vias are not visible in the top view of FIG. 5 . The magnetic field sensing elements 504 a, 504 b and the sensor circuitry may be formed on a die and packaged within an IC package. The current sensor package may be disposed over the PCB to form the current sensor assembly 500. For example, the current sensor package may be surface mounted over the PCB using adhesive or mechanical fasteners.

The illustrative current sensor assembly 500 may be used in a variety of differential current sensing applications. As one example, current sensor assembly 500 may be used to detect for a current leak in a system having a battery. First coil 506 a can be connected within the system such that I₁ corresponds to the current flowing out of the battery, and second coil 506 b can be connected such that I₂ corresponds to the current flowing back to the battery. An imbalance between I₁ and I₂ may indicate a current leak in the system, a potentially dangerous condition. The output of the current sensor assembly—which is proportional or otherwise responsive to I₁-I₂—can be compared to a threshold value, T, to determine if a current leak exists.

Turning to FIGS. 6 and 7 , one or more magnetic field concentrators may be integrated into disclosed currently sensor assembly embodiments to further increase the magnetic coupling factor and allow for sensing of lower currents. The magnetic field concentrators may be the same as or similar to any of the magnetic field concentrators shown or described in U.S. Pat. No. 11,099,217, which issued on Aug. 24, 2021, is entitled “Current sensor having a flux concentrator for redirecting a magnetic field through two magnetic field sensing elements,” and the entire contents of which are herein incorporated by reference. The examples of FIGS. 6 and 7 are based on the current sensor assembly 100 of FIG. 1B. Like elements of FIG. 1B are identified by like reference numerals in FIGS. 6 and 7 and, for brevity, such like elements are generally not discussed again hereinbelow.

FIG. 6 shows a side-view of a current sensor assembly 600 having a single magnetic field concentrator 620 positioned above magnetic field sensing elements 104 a, 104 b, which are themselves positioned above the coils 106 a, 106 b that generate the field to be sensed. The composition, dimensions, and position of the magnetic field concentrator 620 can be selected to concentrate and redirect (or “influence”) magnetic flux lines generated by the coils 106 a, 106 b downward toward magnetic field sensing elements 104 a, 104 b and in the direction of their axes of maximum sensitivity to further improve SNR. In some embodiments, magnetic flux concentrator 620 can be a comprised of a plurality of high permeability layers in order to be less impacted by any eddy currents that may occur within the magnetic flux concentrator 620. This can improve the accuracy of the current sensor assembly 600 when eddy currents are experienced, i.e. when sufficiently high frequency AC currents flow through the coils 106 a, 106 b.

FIG. 7 shows a side-view of a current sensor assembly 700 having two magnetic field concentrators 720 a, 720 a positioned above corresponding ones of the two magnetic field sensing elements 104 a, 104 b, which are themselves positioned above the coils 106 a, 106 b that generate the field to be sensed. The composition, dimensions, and position of the magnetic field concentrators 720 a, 720 b can be selected to concentrate and redirect magnetic flux lines generated by the respective coils 106 a, 106 b downward toward the respective magnetic field sensing elements 104 a, 104 b and in the direction of their respective axes of maximum sensitivity. Having separate magnetic field concentrators 720 a, 720 a for each of the magnetic field sensing elements 104 a, 104 b can further improve the accuracy of the current sensor assembly when eddy currents are experienced.

Turning to FIG. 8 , in some embodiments, additional magnetic field sensing elements can be used to achieve redundancy and/or for diagnostic purposes. As seen in the example of FIG. 8 , a current sensor assembly 800 can include a third magnetic field sensing element 820 a disposed proximate to first coil 106 a and a fourth magnetic field sensing element 820 b disposed proximate to second coil 106 b. The example of FIG. 8 is based on the current sensor assembly 100 of FIG. 1 . Like elements of FIG. 1 are identified by like reference numerals in FIG. 8 and, for brevity, such like elements are generally not discussed again herein.

In some embodiments, the third and fourth magnetic field sensing elements 820 a, 820 b may be vertical Hall elements. As shown, vertical Hall elements 820 a, 820 b may be positioned off-center of the coil structures 106 a, 106 b where the generated field has significant components parallel to the substrate (in contrast to the center of the coils where the generated field is dominantly perpendicular to the substrate). Using magnetic field sensing elements to sense in multiple different orientations can provide redundancy and additional versatility. In other embodiments, GMR, TMR, or AMR elements may be used.

The third and fourth magnetic field sensing elements 820 a, 820 b may be connected to the same circuit as first and second magnetic field sensing elements 104 a, 104 b, or they may be connected to a separate circuit. As an example, the circuitry illustrated in FIG. 2 may be duplicated for each pair of sensing elements such that the current sensor assembly 800 provides two output signals, i.e., one signal in response to the field sensed by first and second magnetic field sensing elements 104 a, 104 b and another signal in response to the field sensed by third and fourth magnetic field sensing elements 820 a, 820 b.

FIG. 9 shows an example of a current sensor assembly having a die and a coil structure formed as a single module or package, according to embodiments of the present disclosure. That is, whereas other embodiments described herein may have the coils structure formed on a PCB and attached to a separate IC package, FIG. 9 illustrates a technique for combining these elements into a single module or package.

An illustrative current sensor assembly 900 includes a coil structure 902 formed within a substrate 942 and a current sensor 924 having an IC 920 and one or more magnetic field sensing elements 904. The IC 920 and magnetic field sensing elements 904 may be provided as a “bare die,” meaning a die that is not packaged. Box 924 can represents an optional physical structure (i.e., package) protecting the bare die. Substrate 942 can support coil connections 910, 916 for connecting to input and output terminals of the coil structure 902, and IC connections 928 for connecting to the IC 920 via one or more leads 930 within the current sensor 924. The current sensor 924 can be overmolded onto the substrate 942 using, for example, an injection molding process. The resulting overmolded structure or module is illustrated by dashed line 926. Of note, the coil connections 910, 916 and the IC connections 928 are left exposed by the overmolding process.

Coil structure 902 may be the same as or similar to various other coil structures disclosed herein, such as coil structure 102 of FIG. 1 , coil structure 302 of FIG. 3 , or coil structure 502 of FIG. 5 . In some embodiments, the substrate 942 may correspond to a PCB substrate and the coil structure 902 may be formed on one or more conductive layers of the PCB. In some embodiments, the substrate 942 may correspond to a substrate of a standalone (or “mini”) PCB. In some embodiments, coil structure 902 may be replaced by a conductive loop such as that illustrated in FIG. 11 .

In some embodiments, the coil structure 902 may be formed to the front side or back side of the bare die providing IC 920. For example, micro winded coils can be printed on to the front or back side of the bare die.

FIG. 10 shows an example of a current sensor assembly having a conductive coil or loop structure integrated into a current sensor package, according to embodiments of the present disclosure. Like elements of FIG. 9 are identified by like reference numerals in FIG. 10 .

An illustrative coil sensor assembly 1000 includes a current sensor package 1030 having the IC 920, one or more magnetic field sensing elements 904, a passivation and isolation layer 1032, and a conductive coil or loop structure 1034. The current sensor package 1030 also has IC connections 928 and coil (or conductive loop) connections 910, 916. The conductive coil or loop structure 1034 can be integrated in the current sensor package 1030 at a lead frame level or below it to provide an integrated low current sensor device.

FIG. 11 shows an example of a current sensor assembly including a conductive loop structure integrated into a current sensor package, according to embodiments of the present disclosure. An illustrative current sensor assembly 1100 includes a conductive loop structure (or “conductive loop” for short) 1102 and magnetic field sensing elements 1104 a, 1104 b, 1104 c, 1104 d, 1104 e, 1104 f (1104, generally) formed within a current sensor package 1130. The current sensor package 1130 can also have circuitry (not shown) for processing the signals generated by the magnetic field sensing elements 1104 and IC connections 1128 for connecting to said circuitry. The current sensor package 1130 can further have one or more input terminals 1110 and one or more output terminals 1116 for connecting to opposite ends of the conductive loop 1102.

As shown in the example of FIG. 11 , the magnetic field sensing elements 1104 may be arranged in differential pairs, with elements 1104 a, 1104 f forming a first pair, elements 1104 b, 1104 e forming a second pair, and elements 1104 c, 1104 d forming a third pair. Other numbers are arrangements of magnetic field sensing elements 1104 may be used. The conductive loop 1102 may be arranged to generate magnetic fields with alternating directions for different ones of the magnetic field sensing elements 1104 in response to a current flowing through the conductive loop 1102. For example, as shown in FIG. 11 , assuming that a current flows from input terminals 1110 to output terminals 1116, conductive loop 1102 may generate a magnetic field directed out of the page for elements 1104 a, 1104 c, and 1104 e, and a magnetic field directed into the page for elements 1104 b, 1104 d, and 1104 f. In some embodiments, magnetic field sensing elements 1104 may be planar Hall elements.

Each of the pairs of magnetic field sensing elements may be connected to a differential current sensor circuit (e.g., a circuit similar to that of FIG. 2 ) to provide multiple output signals each responsive to the current. In the example of FIG. 11 , elements 1104 a, 1104 f may be connected to a first differential sensing circuit, elements 1104 b, 1104 e may be connected to a second differential sensing circuit, and elements 1104 c, 1104 d may be connected to a third differential sensing circuit, resulting in three separate output signals. Having different pairs of sensing elements connected to different differential circuit can provide redundancy and improved safety. In other embodiments, two or more pairs of sensing elements can be connected to the same differential circuit. For example, sensing elements 1004 a, 1004 c, and 1004 e may be connected together to provide a first combined signal and sensing elements 1004 b, 1004 d, and 1004 f may be connected together to provide a second combined signal. The two combined signals may them be used as a differential input to a circuit that is the same as or similar to circuit 201 of FIG. 2 .

With the layout of FIG. 11 , the corresponding magnetic coupling factor (G/A) can be given by the following equation:

${{CFdiff} = {\frac{\left( {{HA_{1}} + {HA_{2}} + {HA_{3}}} \right)}{3} - \frac{\left( {{HB_{1}} + {HB_{2}} + {HB_{3}}} \right)}{3}}},$

in which HA₁, HB₃, HA₂, HB₂, HA₃, and HB₁ correspond to the coupling factors of magnetic field sensing elements 1104 a, 1104 b, 1104 c, 1104 d, 1104 e, and 1104 f, respectively. This equation can be adapted for other numbers of magnetic field sensing elements by changing the terms in the numerators and the constant in the denominators.

Embodiments of the integrated current sensor assembly illustrated in FIG. 11 can be used for sensing low currents while providing stray field immunity as a result of differential sensing.

While electronic circuits shown in figures herein may be shown in the form of analog blocks or digital blocks, it will be understood that the analog blocks can be replaced by digital blocks that perform the same or similar functions and the digital blocks can be replaced by analog blocks that perform the same or similar functions. Analog-to-digital or digital-to-analog conversions may not be explicitly shown in the figures but should be understood.

Various embodiments of the concepts systems and techniques are described herein with reference to the related drawings. Alternative embodiments can be devised without departing from the scope of the described concepts. It is noted that various connections and positional relationships (e.g., over, below, adjacent, etc.) are set forth between elements in the following description and in the drawings. These connections and/or positional relationships, unless specified otherwise, can be direct or indirect, and the present invention is not intended to be limiting in this respect. Accordingly, a coupling of entities can refer to either a direct or an indirect coupling, and a positional relationship between entities can be a direct or indirect positional relationship. As an example of an indirect positional relationship, references in the present description to element or structure A over element or structure B include situations in which one or more intermediate elements or structures (e.g., element C) is between elements A and B regardless of whether the characteristics and functionalities of elements A and/or B are substantially changed by the intermediate element(s).

Furthermore, it should be appreciated that relative, directional or reference terms (e.g. such as “above,” “below,” “left,” “right,” “top,” “bottom,” “vertical,” “horizontal,” “front,” “back,” “rearward,” “forward,” etc.) and derivatives thereof are used only to promote clarity in the description of the figures. Such terms are not intended as, and should not be construed as, limiting. Such terms may simply be used to facilitate discussion of the drawings and may be used, where applicable, to promote clarity of description when dealing with relative relationships, particularly with respect to the illustrated embodiments. Such terms are not, however, intended to imply absolute relationships, positions, and/or orientations. For example, with respect to an object or structure, an “upper” or “top” surface can become a “lower” or “bottom” surface simply by turning the object over. Nevertheless, it is still the same surface and the object remains the same. Also, as used herein, “and/or” means “and” or “or,” as well as “and” and “or.” Moreover, all patent and non-patent literature cited herein is hereby incorporated by references in their entirety.

The terms “disposed over,” “overlying,” “atop,” “on top,” “positioned on” or “positioned atop” mean that a first element, such as a first structure, is present on a second element, such as a second structure, where intervening elements or structures (such as an interface structure) may or may not be present between the first element and the second element. The term “direct contact” means that a first element, such as a first structure, and a second element, such as a second structure, are connected without any intermediary elements or structures between the interface of the two elements. The term “connection” can include an indirect connection and a direct connection.

In the foregoing detailed description, various features are grouped together in one or more individual embodiments for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that each claim requires more features than are expressly recited therein. Rather, inventive aspects may lie in less than all features of each disclosed embodiment.

References in the disclosure to “one embodiment,” “an embodiment,” “some embodiments,” or variants of such phrases indicate that the embodiment(s) described can include a particular feature, structure, or characteristic, but every embodiment can include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment(s). Further, when a particular feature, structure, or characteristic is described in connection knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

The disclosed subject matter is not limited in its application to the details of construction and to the assemblies of the components set forth in the following description or illustrated in the drawings. The disclosed subject matter is capable of other embodiments and of being practiced and carried out in various ways. As such, those skilled in the art will appreciate that the conception, upon which this disclosure is based, may readily be utilized as a basis for the designing of other structures, methods, and systems for carrying out the several purposes of the disclosed subject matter. Therefore, the claims should be regarded as including such equivalent constructions insofar as they do not depart from the spirit and scope of the disclosed subject matter.

Although the disclosed subject matter has been described and illustrated in the foregoing exemplary embodiments, it is understood that the present disclosure has been made only by way of example, and that numerous changes in the details of implementation of the disclosed subject matter may be made without departing from the spirit and scope of the disclosed subject matter.

All publications and references cited herein are expressly incorporated herein by reference in their entirety. 

1. A current sensor assembly, comprising: a coil structure having a first coil and a second coil connected in series, the coil structure configured to generate a differential magnetic field responsive to an electrical current passing through the first and second coils; a first magnetic field sensing element disposed proximate to the first coil and operable to generate a first signal responsive to the differential magnetic field passing through the first magnetic field sensing element in a first direction; a second magnetic field sensing element disposed proximate to the second coil and operable to generate a second signal responsive to the differential magnetic field passing through the second magnetic field sensing element in a second direction; and a circuit operable to subtract the first and second signals to generate a differential signal proportional to the electrical current.
 2. The current sensor assembly of claim 1, wherein the coil structure is formed upon a printed circuit board (PCB) and wherein the first and second magnetic field sensing elements are disposed over the PCB.
 3. The current sensor assembly of claim 2, wherein the first coil and the second coil are formed upon a first layer of the PCB and wherein the first coil and the second coil are connected by a conductive path formed upon a second layer of the PCB.
 4. The current sensor assembly of claim 3, wherein the PCB includes a first via to connect the first coil to the conductive path and a second via to connect the second coil to the conductive path.
 5. The current sensor assembly of claim 3, wherein the coil structure further has a third coil and a fourth coil configured to contribute to the differential magnetic field responsive to the electrical current passing through the third and fourth coils.
 6. The current sensor assembly of claim 5, wherein the third and fourth coils are formed upon the second layer of the PCB and connected to the first and second coils, respectively, by vias of the PCB.
 7. The current sensor assembly of claim 2, wherein the coil structure comprises a plurality of coils including at least the first and second coils, wherein at least two coils from the plurality of coils are formed on different layers of the PCB and interconnected by vias.
 8. The current sensor assembly of claim 2, wherein the first magnetic field sensing element, the second magnetic field sensing element, and the circuit are provided within an integrated circuit (IC) package disposed over the PCB.
 9. The current sensor assembly of claim 1, wherein the first and second magnetic field sensing elements comprises planar Hall elements.
 10. The current sensor assembly of claim 1, wherein the first and second magnetic field sensing elements comprises vertical Hall elements.
 11. The current sensor assembly of claim 1, wherein the current sensor further comprises: a third magnetic field sensing element disposed proximate to the first coil and operable to generate a third signal responsive to the differential magnetic field passing through the third magnetic field sensing element; and a fourth magnetic field sensing element disposed proximate to the second coil and operable to generate a fourth signal responsive to the differential magnetic field passing through the fourth magnetic field sensing element, wherein the circuit is further operable generate the differential signal using the third and fourth signals.
 12. The current sensor assembly of claim 11, wherein the third and fourth magnetic field sensing elements comprise vertical Hall elements.
 13. The current sensor assembly of claim 1, further comprising one or more magnetic flux concentrators operable to influence the differential magnetic field to pass through the first magnetic field sensing element in the first direction and to influence the differential magnetic field to pass through the second magnetic field sensing element in the second direction.
 14. The current sensor assembly of claim 13, wherein the one or more magnetic flux concentrators include a first magnetic flux concentrators disposed proximate to the first magnetic field sensing element and a second magnetic flux concentrators disposed proximate to the second magnetic field sensing element.
 15. The current sensor assembly of claim 13, wherein the one or more magnetic flux concentrators include a single magnetic flux concentrator disposed proximate to both the first and second magnetic field sensing elements.
 16. The current sensor assembly of claim 2, wherein the circuit is provided with a die, and wherein the first magnetic field sensing element, the second magnetic field sensing element, and the die are overmolded onto the PCB.
 17. The current sensor assembly of claim 1, wherein the circuit is provided with a die, and wherein the first magnetic field sensing element, the second magnetic field sensing element, the die, and the coil structure are formed within an integrated circuit (IC) package.
 18. A current sensor assembly, comprising: a first coil structure configured to generate a first magnetic field responsive to a first electrical current passing through the first coil structure; a second coil structure configured to generate a second magnetic field responsive to a first electrical current passing through the second coil structure; a first magnetic field sensing element disposed proximate to the first coil structure and operable to generate a first signal responsive to the first magnetic field passing through the first magnetic field sensing element in a direction; a second magnetic field sensing element disposed proximate to the second coil structure and operable to generate a second signal responsive to the second magnetic field passing through the second magnetic field sensing element in the same direction; and a circuit operable to subtract the first and second signals to generate a differential signal proportional to a difference between the first and second electrical currents.
 19. A current sensor assembly, comprising: a plurality of magnetic field sensing elements disposed on a substrate; a conductive path formed onto the substrate and arranged to loop around ones of the plurality of magnetic field sensing elements to generate a magnetic field about the magnetic field sensing elements responsive to an electrical current passing through the conductive path, wherein at least magnetic field passes through at least one of the magnetic field sensing elements in a first direction and at least another one of the magnetic field sensing elements in a second direction; and one or more differential circuits operable to subtract signals generated by the plurality of magnetic field sensing elements and to generate one or more differential signals proportional to the electrical current.
 20. The current sensor assembly of claim 19, wherein a first pair of the plurality of magnetic field sensing elements are connected to a first one of the one or more differential circuits and a second pair of the plurality of magnetic field sensing elements are connected to a second one of the one or more differential circuits.
 21. The current sensor assembly of claim 19, wherein a first two or more of the plurality of magnetic field sensing elements are connected together, a second two or more of the plurality of magnetic field sensing elements are connected together, and the first two or more and the second two or more of the plurality of magnetic field sensing elements are connected to a same one of the one or more differential circuits. 